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MBD-X11SPi-TF-O

Manufacture Part Number: MBD-X11SPi-TF-O
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Product cycle: Current
0. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W 1. Intel® C622 2. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 10GbE LAN ports 5. 10 SATA3 (6Gbps) via C622 6. I/O: 1 VGA, 2 COM, TPM header 7. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) 8. M.2 NGFF connecto M.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector

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