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MBD-X11SPL-F-O

Manufacture Part Number: MBD-X11SPL-F-O
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Product cycle: Current
0. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W 1. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) 2. Intel® C621 Chipset 3. Expansion slots: 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports 5. 8 SATA3 (6Gbps) ports 6. I/O: 1 VGA, 2 COM, TPM header 7. 2 SuperDOM with built-in power 8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers) 9. M.2 NGFF connecto M.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector

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