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MBD-X11SPW-TF-O

Manufacture Part Number: MBD-X11SPW-TF-O
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Product cycle: Current

0. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP 1. Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots 2. Intel® C622 chipset 3. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 4. 2 10GbE LAN ports 5. 10 SATA3 (6Gbps) via C622 6. I/O: 1 VGA, 2 COM, TPM header 7. 2 SuperDOM with built-in power 8. M.2 NGFF connecto M.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector