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MBD-X11SPM-TPF-O

Manufacture Part Number: MBD-X11SPM-TPF-O
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Product cycle: Current
0. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W TDP 1. Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) 2. Intel® C622 chipset 3. Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8) 4. 2 10G SFP+ 5. 12 SATA3 (6Gbps) via C622 6. Supports 12V DC power input 7. I/O: 1 VGA, 2 COM, 1 TPM header 8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) 9. M.2 NGFF connecto M.2 Interface: PCI-E 3.0 x4Form Factor: 2242, 2280Key: M-Key Double Height Connector