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MBD-X11SPH-nCTF-O

Manufacture Part Number: MBD-X11SPH-nCTF-O
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Product cycle: Current
0. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP 1. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots 2. Intel® C622 chipset 3. Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 10GbE LAN ports 5. 10 SATA3 (6Gbps) via C622 6. 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 7. 2x Port NVMe PCI-E 3.0 x4 via OCuLink 8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers) 9. M.2 NGFF connecto M.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280Key: M-Key Double Height Connector